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Room Temperature Bonding on Interface Between Metal and Ceramic
- Source :
- Journal of Electronic Materials. 48:72-78
- Publication Year :
- 2018
- Publisher :
- Springer Science and Business Media LLC, 2018.
-
Abstract
- The influence of surface activated bonding (SAB) on adhesion strength between a metal and ceramic including Al/AlN and Cu/AlN is investigated. Plasma pre-treatments can significantly increase the adhesion strength between the metal and ceramic through surface activation, which can enlarge the contact area between metal and ceramic. Bonding pressure is also an important factor to improve the adhesion between metal and ceramic during SAB. Successful bonding between the metal and ceramic via SAB can be attributed to the formation of the interface layer where plastic deformation and rearrangement of metal to the ceramic occurs, which improves the atomic scale interconnection between the metal and ceramic. In this study, the influence of experimental SAB conditions for processing such as plasma power, degree of vacuum and bonding pressure on adhesion strength is investigated. Also, the thermal conduction of metal/ceramic laminates is discussed for its potential application as a heat spreader of LED chips.
- Subjects :
- 010302 applied physics
Interconnection
Materials science
02 engineering and technology
Adhesion
021001 nanoscience & nanotechnology
Condensed Matter Physics
Thermal conduction
01 natural sciences
Electronic, Optical and Magnetic Materials
Metal
Surface activated bonding
visual_art
0103 physical sciences
Heat spreader
Materials Chemistry
visual_art.visual_art_medium
Ceramic
Electrical and Electronic Engineering
Composite material
0210 nano-technology
Contact area
Subjects
Details
- ISSN :
- 1543186X and 03615235
- Volume :
- 48
- Database :
- OpenAIRE
- Journal :
- Journal of Electronic Materials
- Accession number :
- edsair.doi...........27edbd6d33831e570dc7ed0bae32cab6