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First demonstration of III-V HBTs on 300 mm Si substrates using nano-ridge engineering
- Source :
- 2019 IEEE International Electron Devices Meeting (IEDM).
- Publication Year :
- 2019
- Publisher :
- IEEE, 2019.
-
Abstract
- In this paper, we demonstrate GaAs/InGaP HBTs grown on a 300 mm Si substrate. A DC current gain of ~112 and breakdown voltage, BV CBO , of 10 V is achieved. The emitter-base and base-collector diodes show an ideality factor of ~1.2 and ~1.4, respectively. This demonstration shows the potential for enabling a hybrid III-V CMOS/ technology for 5G and mm-wave applications, not limited to GaAs but which can also be extended to InGaAs on a 300 mm Si substrate.
- Subjects :
- 010302 applied physics
Materials science
business.industry
020206 networking & telecommunications
02 engineering and technology
01 natural sciences
Dc current
CMOS
Si substrate
0103 physical sciences
Nano
0202 electrical engineering, electronic engineering, information engineering
Ridge (meteorology)
Optoelectronics
Breakdown voltage
business
Diode
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2019 IEEE International Electron Devices Meeting (IEDM)
- Accession number :
- edsair.doi...........25cd121e429454e0d8758a302ad4b0a5
- Full Text :
- https://doi.org/10.1109/iedm19573.2019.8993539