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First demonstration of III-V HBTs on 300 mm Si substrates using nano-ridge engineering

Authors :
Liesbeth Witters
Niamh Waldron
A. S. Hernandez
Bertrand Parvais
A. Vais
Mark Ingels
Bernardette Kunert
Yves Mols
Amey Mahadev Walke
Reynald Alcotte
Marina Baryshnikova
Robert Langer
Hao Yu
P. Wambacq
G. Mannaert
Nadine Collaert
Veeresh Deshpande
Source :
2019 IEEE International Electron Devices Meeting (IEDM).
Publication Year :
2019
Publisher :
IEEE, 2019.

Abstract

In this paper, we demonstrate GaAs/InGaP HBTs grown on a 300 mm Si substrate. A DC current gain of ~112 and breakdown voltage, BV CBO , of 10 V is achieved. The emitter-base and base-collector diodes show an ideality factor of ~1.2 and ~1.4, respectively. This demonstration shows the potential for enabling a hybrid III-V CMOS/ technology for 5G and mm-wave applications, not limited to GaAs but which can also be extended to InGaAs on a 300 mm Si substrate.

Details

Database :
OpenAIRE
Journal :
2019 IEEE International Electron Devices Meeting (IEDM)
Accession number :
edsair.doi...........25cd121e429454e0d8758a302ad4b0a5
Full Text :
https://doi.org/10.1109/iedm19573.2019.8993539