The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys

MLA

Dh Kim, et al. “The Wetting, Reaction and Bonding of Silicon Nitride by Cu-Ti Alloys.” Journal of Materials Science, vol. 26, June 1991, pp. 3223–34. EBSCOhost, https://doi.org/10.1007/bf01124666.

APA

Dh Kim, Sh Hwang, & Soung Soon Chun. (1991). The wetting, reaction and bonding of silicon nitride by Cu-Ti alloys. Journal of Materials Science, 26, 3223–3234. https://doi.org/10.1007/bf01124666

Chicago

Dh Kim, Sh Hwang, and Soung Soon Chun. 1991. “The Wetting, Reaction and Bonding of Silicon Nitride by Cu-Ti Alloys.” Journal of Materials Science 26 (June): 3223–34. doi:10.1007/bf01124666.