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Schottky Source/Drain InAlN/AlN/GaN MISHEMT With Enhanced Breakdown Voltage
- Source :
- IEEE Electron Device Letters. 33:38-40
- Publication Year :
- 2012
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2012.
-
Abstract
- In this letter, we present the deployment of Schottky source/drain (SSD) in InAlN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MISHEMTs) for off-state breakdown voltage improvement. The improved breakdown voltage relies on the suppression of electron injection into the buffer under the Schottky source contact. A VBD of 460 V is obtained in an SSD MISHEMT with an LGD = 10nμm, at a 170% improvement compared with that of the control MISHEMT featuring ohmic source/drain. Despite the SSD contacts, an SSD MISHEMT with a gate length of 1 μm exhibits a respectable drain current density of 416 mA/mm and a transconductance of 113 mS/mm.
- Subjects :
- Materials science
business.industry
Transconductance
Transistor
Wide-bandgap semiconductor
Schottky diode
Gallium nitride
Electronic, Optical and Magnetic Materials
law.invention
chemistry.chemical_compound
chemistry
law
Logic gate
Optoelectronics
Breakdown voltage
Electrical and Electronic Engineering
business
Ohmic contact
Subjects
Details
- ISSN :
- 15580563 and 07413106
- Volume :
- 33
- Database :
- OpenAIRE
- Journal :
- IEEE Electron Device Letters
- Accession number :
- edsair.doi...........2488c6ac8bd9ae4dfc3875d865fbe4ad