Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solders

In this paper, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) was incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. After that, the electrochemical behavior of Sn-Ag-Cu with varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) composite solder were investigated in 0.3% Na2SO4 solution by using potentiodynamic polarization method. Scanning microscopy was used to characterize the samples after the electrochemical tests. It was observed that the corrosion resistance decreased when the content of Ni-CNTs reached a certain level.