Modeling and fabrication of the redistribution layer on the 2.5D Si interposer

MLA

Zhiyu Jin, et al. “Modeling and Fabrication of the Redistribution Layer on the 2.5D Si Interposer.” 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Aug. 2017. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........20af2de71a1f608ddf4ec3db7ae887ce&authtype=sso&custid=ns315887.

APA

Zhiyu Jin, Yating Sun, Jian Li, Yan Wang, Guifu Ding, Yunna Sun, & Jiangbo Luo. (2017). Modeling and fabrication of the redistribution layer on the 2.5D Si interposer. 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Chicago

Zhiyu Jin, Yating Sun, Jian Li, Yan Wang, Guifu Ding, Yunna Sun, and Jiangbo Luo. 2017. “Modeling and Fabrication of the Redistribution Layer on the 2.5D Si Interposer.” 2017 18th International Conference on Electronic Packaging Technology (ICEPT), August. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........20af2de71a1f608ddf4ec3db7ae887ce&authtype=sso&custid=ns315887.