Die-attach Properties of Pressure-sintered Copper Joints on Adhesive Metallization Surfaces in N2 Atmosphere

Die-attach properties of mechanical pressure-assisted sintered copper (pressure-sintered Cu) on some metallization layers in N2 atmosphere for high-power devices were investigated. The shear strength of pressure-sintered Cu on Ag plating increased as the bonding temperatures and bonding pressures increased. On the bonding conditions (2 MPa, 300 °C, 3 min and 60 min), the shear strength of pressure-sintered Cu on Ni and Ag plating increased with increasing bonding time, whereas that of pressure-sintered Cu on Au plating decreased. The decrease of shear strength on the Au plating was seemingly attributed to the marked interdiffusion of the interface between sintered Cu and Au plating.