Guest Editorial Special Section—Papers From the 2019 MASM/WSC Conference

The 2019 International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2019) was part of the 2019 Winter Simulation Conference (WSC) that was held December 8–11 in National Harbor, MD, USA. The MASM conferences provide a forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modeling and analysis of complex high-tech manufacturing systems. While the papers from MASM conferences are of high quality and are often cited in journal papers, they are limited in size. As a premier journal for topics covered in the MASM conferences, IEEE T ransactions on S emiconductor M anufacturing , agreed to consider extended article submissions based on the 21 papers accepted and presented at the MASM 2019 conference for a Special Section of an upcoming issue of the journal. were sessions on Scheduling and Dispatching, Fab Scheduling, Maintenance and Engineering, Capacity and Production Planning, Qualification and Wafer-to-Order Allocation, Semiconductor Manufacturing Models, and Semiconductor Modeling Representations. Dr. Sabine Herlitschka, Chief Executive Officer and Chief Technology Officer of Infineon Technologies Austria AG, gave an excellent keynote talk titled “A European View on Future Semiconductor Industry Needs for MASM.” An archive of the MASM 2019 papers can be found at https://informs-sim.org/wsc19papers/by_area.html .