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Enhancement of thermoelectric performance by tuning selenium content in the Cu2SnSe3 compound
- Source :
- Intermetallics. 122:106803
- Publication Year :
- 2020
- Publisher :
- Elsevier BV, 2020.
-
Abstract
- To investigate the thermoelectric properties, we have attempted to tune selenium content in Cu2SnSe3-δ (−0.04 ≤ δ ≤ 0.1) compounds synthesized via the conventional solid-state reaction. Electrical and thermal properties are presented in the low and near room temperature regime (10–350 K). The lowest electrical resistivity is observed for the compound with δ = 0.08. The electron-phonon coupling and the presence of small polarons are experimentally validated from temperature-dependent electrical and thermal transport data. A decrease in the Seebeck coefficient along with carrier concentration is observed, verifying the linear electron band dispersion. A downward shift of the Fermi level deep into the valence band is realized in the case of non-stoichiometric samples, thereby reducing the Seebeck coefficient. A maximum power factor of ~50 μWmK−2 is achieved for the sample with δ = 0.04, which is about twice that of the pristine compound. The highest ZT of ~0.01 is obtained for the compound with δ = 0.08. The observed results suggest that stoichiometry plays a vital role in tuning the thermoelectric properties in the Cu2SnSe3 compound.
- Subjects :
- 010302 applied physics
Materials science
Mechanical Engineering
Fermi level
Metals and Alloys
Analytical chemistry
02 engineering and technology
General Chemistry
Electron
021001 nanoscience & nanotechnology
Polaron
01 natural sciences
symbols.namesake
Mechanics of Materials
Electrical resistivity and conductivity
Seebeck coefficient
0103 physical sciences
Thermoelectric effect
Materials Chemistry
symbols
0210 nano-technology
Dispersion (chemistry)
Stoichiometry
Subjects
Details
- ISSN :
- 09669795
- Volume :
- 122
- Database :
- OpenAIRE
- Journal :
- Intermetallics
- Accession number :
- edsair.doi...........1d56fe393be33e2e22f553ebd406dbe2
- Full Text :
- https://doi.org/10.1016/j.intermet.2020.106803