Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films

MLA

D. R. Frear, et al. “Effect of Cu at Al Grain Boundaries on Electromigration Behavior in Al Thin Films.” SPIE Proceedings, Dec. 1991. EBSCOhost, https://doi.org/10.1117/12.51013.

APA

D. R. Frear, Choong-Un Kim, Joseph R. Michael, J. W. Morris, & Alton D. Romig Jr. (1991). Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films. SPIE Proceedings. https://doi.org/10.1117/12.51013

Chicago

D. R. Frear, Choong-Un Kim, Joseph R. Michael, J. W. Morris, and Alton D. Romig Jr. 1991. “Effect of Cu at Al Grain Boundaries on Electromigration Behavior in Al Thin Films.” SPIE Proceedings, December. doi:10.1117/12.51013.