Signal Integrity Improvement on High-Speed Packaging Routing by Enhanced T Stub

In this paper, T stub is adopted in the microstrip lines of the high-speed packaging to reduce the crosstalk. The impedance matching is also improved by using the enhanced core via with optimized surrounding ground vias. The simulation results show the lower far-end crosstalk and better impedance matching design are achieved. The signal integrity of the high-speed packaging has been improved and verified by the eye-diagram performance in the experiments.