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Signal Integrity Improvement on High-Speed Packaging Routing by Enhanced T Stub
- Source :
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
- Publication Year :
- 2020
- Publisher :
- IEEE, 2020.
-
Abstract
- In this paper, T stub is adopted in the microstrip lines of the high-speed packaging to reduce the crosstalk. The impedance matching is also improved by using the enhanced core via with optimized surrounding ground vias. The simulation results show the lower far-end crosstalk and better impedance matching design are achieved. The signal integrity of the high-speed packaging has been improved and verified by the eye-diagram performance in the experiments.
- Subjects :
- Computer science
Impedance matching
020206 networking & telecommunications
Hardware_PERFORMANCEANDRELIABILITY
02 engineering and technology
Microstrip
Stub (electronics)
Crosstalk
Electric power transmission
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
Signal integrity
Electrical impedance
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
- Accession number :
- edsair.doi...........1cd2bc8a3f9377539af1bb847b4d5671