A New FOWLP Platform for Hybrid Optical Packaging - Demonstration on 100Gbps Transceiver

The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentially higher performance, and expendability to on-board/co-packaged optical interconnections. To prove the new packaging idea, 100GBASE-SR4 standard is targeted in this demonstration.