Back to Search
Start Over
Pressing Simulations within the PCB Manufacturing Framework
- Source :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Accession number :
- edsair.doi...........1bf0b145a50bed29ccbd70bed93703a5
- Full Text :
- https://doi.org/10.1109/eurosime54907.2022.9758910