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An optimized face-down bonding process for laser diode packages
- Source :
- Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
- Publication Year :
- 2005
- Publisher :
- IEEE, 2005.
-
Abstract
- We present an optimized face-down die attachment for single-mode ridge-waveguide laser diodes (LDs) using Au80Sn20 solder. Based on this improved technique, a bonding process window has been determined through microstructure and mechanical investigation of the solder joint, and electro-optical characterization of LDs. Metallographical investigation shows that the solder joint comprises of a layer of /spl delta/ phase near the LD/solder and solder/heatsink interfaces, /spl zeta/ phase at the center of the solder joint, and a layer of (Au, Ni)Sn intermetallic compound (IMC) at the solder/heatsink interface. The /spl delta/ phase shifted to the interfaces, while /spl zeta/ phase Au/Sn compound is remaining at the center of the joint, is postulated by the lower surface tension in /spl delta/ phase. Mechanical shear testing demonstrates good bonding integrity, which meets the requirements specified by MIL-STD-883C. Fracture surface characterization shows brittle fracture occurring within the LD, at the GaAs/SiN interface. This optimized bonding process can achieve optical improvement of 2.5-3/spl times/ compared to unbonded LDs due to good thermal management.
Details
- Database :
- OpenAIRE
- Journal :
- Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
- Accession number :
- edsair.doi...........1be5d43cac452e3b46a978a394ccabf8