Microstructural Control of Internal Electromigration Failure in Narrow Al-Cu-Si Lines

MLA

Choong-Un Kim, et al. “Microstructural Control of Internal Electromigration Failure in Narrow Al-Cu-Si Lines.” MRS Proceedings, vol. 391, Jan. 1995. EBSCOhost, https://doi.org/10.1557/proc-391-353.

APA

Choong-Un Kim, S. H. Kang, & J. W. Morris. (1995). Microstructural Control of Internal Electromigration Failure in Narrow Al-Cu-Si Lines. MRS Proceedings, 391. https://doi.org/10.1557/proc-391-353

Chicago

Choong-Un Kim, S. H. Kang, and J. W. Morris. 1995. “Microstructural Control of Internal Electromigration Failure in Narrow Al-Cu-Si Lines.” MRS Proceedings 391 (January). doi:10.1557/proc-391-353.