Cite

Generation of cavities in silicon wafers by laser ablation using silicon nitride as sacrificial layer

MLA

C. Toro, et al. “Generation of Cavities in Silicon Wafers by Laser Ablation Using Silicon Nitride as Sacrificial Layer.” Applied Surface Science, vol. 258, Jan. 2012, pp. 2914–19. EBSCOhost, https://doi.org/10.1016/j.apsusc.2011.11.007.



APA

C. Toro, Carlos Lasorsa, Carlos A. Rinaldi, Alberto Lamagna, Alfredo Boselli, M.S. Perez, & B. Lerner. (2012). Generation of cavities in silicon wafers by laser ablation using silicon nitride as sacrificial layer. Applied Surface Science, 258, 2914–2919. https://doi.org/10.1016/j.apsusc.2011.11.007



Chicago

C. Toro, Carlos Lasorsa, Carlos A. Rinaldi, Alberto Lamagna, Alfredo Boselli, M.S. Perez, and B. Lerner. 2012. “Generation of Cavities in Silicon Wafers by Laser Ablation Using Silicon Nitride as Sacrificial Layer.” Applied Surface Science 258 (January): 2914–19. doi:10.1016/j.apsusc.2011.11.007.