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Flip‐chip bonding with solder dipping
- Source :
- Review of Scientific Instruments. 56:1459-1460
- Publication Year :
- 1985
- Publisher :
- AIP Publishing, 1985.
-
Abstract
- We report a simple technique for making flip‐chip contacts. The equipment required, in addition to a small‐scale photoresist clean room, is a beaker of molten solder.
Details
- ISSN :
- 10897623 and 00346748
- Volume :
- 56
- Database :
- OpenAIRE
- Journal :
- Review of Scientific Instruments
- Accession number :
- edsair.doi...........182a8ce723e3bd263919688712f4cbca
- Full Text :
- https://doi.org/10.1063/1.1138505