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Bump non-wet issue in large-die flip chip package with eutectic Sn/Pb solder bump and SOP substrate pad
- Source :
- Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
- Publication Year :
- 2005
- Publisher :
- IEEE, 2005.
-
Abstract
- This paper describes a study on non-wet issue encountered in flip chip assembly process of high-density flip chip ball grid array (FCBGA) packages with eutectic Sn/Pb solder interconnects. A nonwet occurrence is more obvious in large-die flip chip (die size >16mm) with high I/O counts (>1000). Thermal-mechanical mismatch between die and substrate shows a role in affecting soldering condition of the die solder bump and substrate SOP. Positive evaluation results, involving: 1) new flux material with increased percentage of solid content or modified activator and 2) plasma treatment on substrate prior to FC assembly, indicate that a more effective approach is needed to improve bump solderability in large die flip chip devices
Details
- Database :
- OpenAIRE
- Journal :
- Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
- Accession number :
- edsair.doi...........17f1d36cdf76058ad50ff668d1ab4007