Evaluation of low dielectric constant materials for on-chip interconnects-an industry/university research collaboration

This paper describes the collaboration between university and industry in the evaluation of low dielectric materials for on-chip interconnect applications. The collaboration has established selection criteria and characterization methodologies for materials evaluation of dielectric thin films in the micron range. A review on the concerted efforts of semiconductor industry, materials suppliers, university and consortium in materials and processing evaluation and in improving the interlayer dielectrics (ILD) materials in alignment of SIA Technology Roadmap are described. The characterization techniques of thin films and results of materials evaluation are discussed.