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Extreme high pressure and high temperature package development

Authors :
Eric Phua Jian Rong
Vivek Chidambaram
Chan Yuen Sing
Lee Jong Bum
Hwang How Yuan
Gan Chee Lip
Daniel Rhee Min Woo
Eva Wai Leong Ching
Source :
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Publication Year :
2013
Publisher :
IEEE, 2013.

Abstract

As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the authors are proposing to fill high temperature and high pressure endurable protective materials inside of ceramic substrate cavity to absorb the package internal stress caused by the external high pressure loading. The reliability of the package has been successfully demonstrated under combined 30kpsi isostatic pressure and 300°C temperature (HPHT) aging condition for 500 hours as well as thermal cycling condition for 500 cycles.

Details

Database :
OpenAIRE
Journal :
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Accession number :
edsair.doi...........172d9ffd1292224209c9e84bf84aa76e
Full Text :
https://doi.org/10.1109/eptc.2013.6745746