The Adhesion of Evaporated Copper to Dow Cyclotene 3022®, Determined by Microscratch Testing

MLA

De-Quan Yang, et al. “The Adhesion of Evaporated Copper to Dow Cyclotene 3022®, Determined by Microscratch Testing.” The Journal of Adhesion, vol. 77, Dec. 2001, pp. 309–21. EBSCOhost, https://doi.org/10.1080/00218460108030744.

APA

De-Quan Yang, Ludvik Martinu, Edward Sacher, & A. Sadough-vanini. (2001). The Adhesion of Evaporated Copper to Dow Cyclotene 3022®, Determined by Microscratch Testing. The Journal of Adhesion, 77, 309–321. https://doi.org/10.1080/00218460108030744

Chicago

De-Quan Yang, Ludvik Martinu, Edward Sacher, and A. Sadough-vanini. 2001. “The Adhesion of Evaporated Copper to Dow Cyclotene 3022®, Determined by Microscratch Testing.” The Journal of Adhesion 77 (December): 309–21. doi:10.1080/00218460108030744.