Solid-state electrochemical nanoimprinting of copper

MLA

Nicholas X. Fang, et al. “Solid-State Electrochemical Nanoimprinting of Copper.” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 25, Jan. 2007, p. 2419. EBSCOhost, https://doi.org/10.1116/1.2799977.

APA

Nicholas X. Fang, Keng Hsu, Peter L. Schultz, & Placid M. Ferreira. (2007). Solid-state electrochemical nanoimprinting of copper. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 25, 2419. https://doi.org/10.1116/1.2799977

Chicago

Nicholas X. Fang, Keng Hsu, Peter L. Schultz, and Placid M. Ferreira. 2007. “Solid-State Electrochemical Nanoimprinting of Copper.” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25 (January): 2419. doi:10.1116/1.2799977.