Cite
EBIC/PL investigations of dislocation network produced by silicon wafer direct bonding
MLA
T. Wilhelm, et al. “EBIC/PL Investigations of Dislocation Network Produced by Silicon Wafer Direct Bonding.” Superlattices and Microstructures, vol. 45, Apr. 2009, pp. 314–20. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........15bee4204776fbb4be6f9c646e19c2fe&authtype=sso&custid=ns315887.
APA
T. Wilhelm, Winfried Seifert, Teimuraz Mchedlidze, Guobin Jia, Martin Kittler, T. Arguirov, & Manfred Reiche. (2009). EBIC/PL investigations of dislocation network produced by silicon wafer direct bonding. Superlattices and Microstructures, 45, 314–320.
Chicago
T. Wilhelm, Winfried Seifert, Teimuraz Mchedlidze, Guobin Jia, Martin Kittler, T. Arguirov, and Manfred Reiche. 2009. “EBIC/PL Investigations of Dislocation Network Produced by Silicon Wafer Direct Bonding.” Superlattices and Microstructures 45 (April): 314–20. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........15bee4204776fbb4be6f9c646e19c2fe&authtype=sso&custid=ns315887.