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Interfacial Reaction Between Silver and Solid Indium

Authors :
I. C. Fang
F. L. Chang
C. C. Chang
C. R. Kao
Source :
2023 International Conference on Electronics Packaging (ICEP).
Publication Year :
2023
Publisher :
IEEE, 2023.

Details

Database :
OpenAIRE
Journal :
2023 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........1467cc947866e83d307c97bc7a9e3202

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