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Poly Si-Si interfacial oxide ball-up mechanism and its control for 0.8 mu m BiCMOS VLSIs

Authors :
T. Maeda
H. Momose
J. Matsunaga
M. Higashizono
Source :
Proceedings of the Bipolar Circuits and Technology Meeting.
Publication Year :
2003
Publisher :
IEEE, 2003.

Abstract

Three samples with different thicknesses of polysilicon-silicon interfacial oxide were prepared. The influence of the interfacial oxide on the electrical characteristics of 0.8- mu m BiCMOS VLSIs was studied. From the results, the maximum interfacial oxide thickness allowed for BiCMOS LSIs was determined. To control the interfacial oxide thickness, the ball-up mechanism was studied using HRXTEM combined with energy-dispersive X-ray spectroscopy measurements. The optimum heat treatment after emitter deposition to realize 0.5- mu m BiCMOS VLSI was also determined. >

Details

Database :
OpenAIRE
Journal :
Proceedings of the Bipolar Circuits and Technology Meeting
Accession number :
edsair.doi...........130d15d05918a4f78104219567316227
Full Text :
https://doi.org/10.1109/bipol.1989.69468