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High bandwidth memory(HBM) with TSV technique
- Source :
- ISOCC
- Publication Year :
- 2016
- Publisher :
- IEEE, 2016.
-
Abstract
- In this paper, HBM DRAM with TSV technique is introduced. This paper covers the general TSV feature and techniques such as TSV architecture, TSV reliability, TSV open / short test, and TSV repair. And HBM DRAM, representative DRAM product using TSV, is widely presented, especially the use and features.
- Subjects :
- 010302 applied physics
Very-large-scale integration
Engineering
Random access memory
Hardware_MEMORYSTRUCTURES
business.industry
Bandwidth (signal processing)
020206 networking & telecommunications
Hardware_PERFORMANCEANDRELIABILITY
02 engineering and technology
High Bandwidth Memory
01 natural sciences
Embedded system
0103 physical sciences
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
Hardware_ARITHMETICANDLOGICSTRUCTURES
business
Dram
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2016 International SoC Design Conference (ISOCC)
- Accession number :
- edsair.doi...........12e2566f6de4e93bbf2dd1c9055d10a7