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Study of pore structure and stability in porous low-k interconnects using electrolyte voltammetry

Authors :
Choong-Un Kim
Young-Joon Park
Dongmei Meng
N. L. Michael
Source :
Applied Physics Letters. 88:261911
Publication Year :
2006
Publisher :
AIP Publishing, 2006.

Abstract

This letter presents a step-mode voltammetry method which uses ion diffusivity to characterize pore structure in both dense and porous low dielectric constant materials (low k) in patterned interconnect structures. Findings reveal that the intramolecular space in dense low k acts like a small physical pore network. It is determined that electrolyte ions can migrate through such space in dense low k, but with higher activation energy than in porous low k or the bulk solution, 0.31eV vs 0.18–0.19eV. Also, this study finds that the pores in ultralow k are not stable but can either coalesce or collapse depending on stress conditions.

Details

ISSN :
10773118 and 00036951
Volume :
88
Database :
OpenAIRE
Journal :
Applied Physics Letters
Accession number :
edsair.doi...........126dea33d23e7b3bd0147a190e280a5f
Full Text :
https://doi.org/10.1063/1.2218060