Back to Search Start Over

Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage during Semiconductor Wafer Separation

Authors :
Seong-Min Lee
Source :
MATERIALS TRANSACTIONS. 58:530-534
Publication Year :
2017
Publisher :
Japan Institute of Metals, 2017.

Subjects

Subjects :
0209 industrial biotechnology
Materials science
business.industry
Mechanical Engineering
02 engineering and technology
021001 nanoscience & nanotechnology
Condensed Matter Physics
Wafer backgrinding
Die preparation
020901 industrial engineering & automation
Mechanics of Materials
Forensic engineering
Optoelectronics
General Materials Science
Wafer dicing
Wafer
0210 nano-technology
business

Details

ISSN :
13475320 and 13459678
Volume :
58
Database :
OpenAIRE
Journal :
MATERIALS TRANSACTIONS
Accession number :
edsair.doi...........104ce2bd4aa8128100aa7dac2e7539b1
Full Text :
https://doi.org/10.2320/matertrans.m2016366
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details