Cite

3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer

MLA

Y. Zhang, et al. “3D Monolithic Integration of ScAlN-Based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer.” 2022 International Electron Devices Meeting (IEDM), Dec. 2022. EBSCOhost, https://doi.org/10.1109/iedm45625.2022.10019557.



APA

Y. Zhang, X. Wang, C. Liu, E. Y. Z. Woo, W. Yang, Q. Zhang, H. Lin, D. Yan, R. M. Kumarasamy, B. Chen, N. Wang, & Y. Zhu. (2022). 3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer. 2022 International Electron Devices Meeting (IEDM). https://doi.org/10.1109/iedm45625.2022.10019557



Chicago

Y. Zhang, X. Wang, C. Liu, E. Y. Z. Woo, W. Yang, Q. Zhang, H. Lin, et al. 2022. “3D Monolithic Integration of ScAlN-Based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer.” 2022 International Electron Devices Meeting (IEDM), December. doi:10.1109/iedm45625.2022.10019557.