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Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests
- Source :
- 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
- Publication Year :
- 2020
- Publisher :
- IEEE, 2020.
-
Abstract
- With increasing thermal loads in electronic packages, liquid cooling is a preferred option for superior cooling capability. Closed loop liquid cooling systems with microchannel cold plates have demonstrated superior thermal performance. The widespread adaptation of this technology, however, is subject to long term reliability concerns, especially caused by corrosion with a water-based coolant. Galvanic corrosion, which is caused by the difference in electrode potentials is observed to be the dominant failure mechanism.In this paper, the design and development of flow loops suitable for capturing the corrosion behavior within the loop is discussed. Careful consideration of all components within the loop and the rationales behind the choices are highlighted. The experimental methodology details various sensors and measurements required to assess corrosion development in the loop. Experimental results from the flow loop tests are presented and engineering recommendations are made for flow loop design, choice of working fluid and measurements to be made in-situ. Although there is a clear indication of corrosion progression based on the experimental data of fluid chemistry degradation, no significant impact is observed on thermal performance of the current microchannel cold plate design for the duration of the current test conditions.
- Subjects :
- Microchannel
Materials science
Computer cooling
020209 energy
Nuclear engineering
Flow (psychology)
02 engineering and technology
021001 nanoscience & nanotechnology
Corrosion
Coolant
Galvanic corrosion
0202 electrical engineering, electronic engineering, information engineering
Working fluid
Current (fluid)
0210 nano-technology
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
- Accession number :
- edsair.doi...........0f1ac078752f1026dadf7ce0965e87c5
- Full Text :
- https://doi.org/10.1109/itherm45881.2020.9190607