Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

This paper studies mainly the diffusion bonding of 3Y-TZP/SUS304 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS304, the Ti-Cu powder/sheet was used as bonding materials. In bonding process, multi-alloy with Fe-Ti and Fe-Cu have been confirmed by Electron Probe Micro-Analyzer (EPMA) determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS304 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.