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Reliability Prediction Platform of SiC Half Bridge Power Module

Authors :
J. Y. Syu
Y. C. Huang
Y. C. Liu
P. K. Chiu
K. S. Kao
T. C. Chang
Source :
2023 International Conference on Electronics Packaging (ICEP).
Publication Year :
2023
Publisher :
IEEE, 2023.

Details

Database :
OpenAIRE
Journal :
2023 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........0ccc853a21b06babd085c5d3a8660a77

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