Numerical Simulation of the Multi-Wire Sawing Process Using Time-Varying Parameters and the Experimental Validations

27th European Photovoltaic Solar Energy Conference and Exhibition; 960-963
Wire sawing is the most common technology to fabricate silicon wafers in the current solar cell industry. The sawing performance is determined by operating parameters such as the wire speed, the table speed and the wire tension besides the wire types and the wearing status. In order to enhance the cutting performance as well as to maintain the mechanical stability, those parameters are usually adjusted by a predefined recipe along the cutting process. In this study, the material removal process was numerically simulated along the cutting time. The simulation was used to identify the low cutting efficiency regime. The adjusted recipe has been proved by experiments to demonstrate the validity of the numerical modeling.