Reliability Improvement of Large BGA-Packages Using Sidefill Support

Authors :: Manuel Heine
Karsten Meier
Laura Wambera
Karlheinz Bock
Christian Gotze
Source :: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Publication Year :: 2022
Publisher :: IEEE, 2022.

Database :: OpenAIRE
Journal :: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
Accession number :: edsair.doi...........0b8b8f396a67e56dad82593b46aff43f
Full Text :: https://doi.org/10.1109/estc55720.2022.9939434