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Atomic layer deposition of transition metal films and nanostructures for electronic and catalytic applications

Authors :
Jennifer M. Pringle
Mikhael Bechelany
James W. Maina
Ludovic F. Dumée
Matthieu Weber
Andrea Merenda
Lachlan Hyde
Source :
Critical Reviews in Solid State and Materials Sciences. 46:468-489
Publication Year :
2020
Publisher :
Informa UK Limited, 2020.

Abstract

Atomic layer deposition (ALD) has emerged as the technique of choice in the microelectronics industry, owing to its self-limiting nature, that allows conformal film deposition in highly confined sp...

Details

ISSN :
15476561 and 10408436
Volume :
46
Database :
OpenAIRE
Journal :
Critical Reviews in Solid State and Materials Sciences
Accession number :
edsair.doi...........0b0930918816e5128ccf95d0ec6cfd31
Full Text :
https://doi.org/10.1080/10408436.2020.1819200