Deposition of gold on polyimide from solutions

Laser-assisted deposition of gold is investigated as a technique for structured metallization of PI. Gold lines are written from MeAuPMe 3 dissolved in toluene or DME by means of an argon laser. The writing speed of the laser process typically is 1 mm/s for traces of 200 nm thickness. The height of the gold lines can be further increased by multiple scanning. Fixing of open circuit defects on wiring boards is feasible by repeated laser processing, where gold lines in a thickness of some microns can be written. The adhesion of the lines is sufficient to pass the usual tape test.