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High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package

Authors :
Shinyoung Park
Dongho Ha
Joungho Kim
Michael Bae
Junyong Park
Hyesoo Kim
Bumhee Bae
Sumin Choi
Jonghoon Kim
Source :
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1356-1368
Publication Year :
2017
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2017.

Abstract

As a demand for electrical systems with a wide data bandwidth has increased, high-performance packages ensuring high data rates, such as low power double data rate series, have become common. The need for high-performance test sockets has also emerged to test these packages. However, a conventional pogo pin socket has a limited test bandwidth due to the parasitic components arising from its spring. On the other hand, a silicone rubber socket satisfies the wide bandwidth requirement because it has low parasitic components due to high-density conductive metal powders in an elastic silicone rubber. In this paper, we propose an RLGC equivalent circuit model of a silicone rubber socket and first experimentally verify it. The proposed model is experimentally verified in the frequency domain by comparing the insertion loss obtained from the proposed model to the measurement up to 20 GHz. The proposed model is experimentally verified in the time domain by comparing the eye diagrams obtained from the proposed model to the measurement at a data rate of 12.5 Gb/s. Also, the insertion loss of the sockets with varied height, diameter, and pitch is analyzed using the proposed model. The proposed model provides physical insight of a silicone rubber socket, and it allows to determine whether a socket is reliable for testing high performance packages in a short time. It also gives us the idea how to design a high-performance test socket. Furthermore, we discuss the current capacity and life cycle of the silicone rubber socket in terms of signal integrity as well.

Details

ISSN :
21563985 and 21563950
Volume :
7
Database :
OpenAIRE
Journal :
IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :
edsair.doi...........07c42de2c1c3f1c086e29adc254c5a24
Full Text :
https://doi.org/10.1109/tcpmt.2017.2712362