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Technoeconomic Analysis of Photovoltaics Module Manufacturing with Thin Silicon Wafers

Authors :
Michael Woodhouse
Zhe Liu
Sarah E. Sofia
Ian Marius Peters
Hannu S. Laine
Sarah Wieghold
Tonio Buonassisi
Source :
2019 IEEE 46th Photovoltaic Specialists Conference (PVSC).
Publication Year :
2019
Publisher :
IEEE, 2019.

Abstract

Reducing silicon usage by adopting thinner wafers can significantly reduce capital expenditure (capex) and cost, and thus accelerate the growth of manufacturing capacity and deployment. In this work, we evaluated potential benefits of thin Si wafers for current and future PV modules. We apply a technoeconomic framework that couples bottom-up cost model, and a cash-flow growth model to analyze PV modules with thin wafers. First, we show that, comparing the current PERC with 160 µm thick wafers to the high-efficiency concept with 50 µm thin wafers, the capex is reduced from 0.39 to 0.2 $/(W/year) while the cost is from 0.32 to 0.2 $/W. Second, the potential of accelerated deployment is analyzed for the high-efficiency thin wafer concept. We found the significant advantages of higher growth rate (~20% relative) and higher deployment plateau (~3 times) than the current PERC modules.

Details

Database :
OpenAIRE
Journal :
2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)
Accession number :
edsair.doi...........07bfb9305ff0ee6fe85834983f8da9ab
Full Text :
https://doi.org/10.1109/pvsc40753.2019.8980702