Impact of in situ current stressing on Sn-based solder joint shear stability

MLA

Scott Fuller, et al. “Impact of in Situ Current Stressing on Sn-Based Solder Joint Shear Stability.” Journal of Materials Science: Materials in Electronics, vol. 32, Jan. 2021, pp. 2853–64. EBSCOhost, https://doi.org/10.1007/s10854-020-05038-3.

APA

Scott Fuller, Mohamed Sheikh, Choong-Un Kim, Tae-Kyu Lee, & Greg Baty. (2021). Impact of in situ current stressing on Sn-based solder joint shear stability. Journal of Materials Science: Materials in Electronics, 32, 2853–2864. https://doi.org/10.1007/s10854-020-05038-3

Chicago

Scott Fuller, Mohamed Sheikh, Choong-Un Kim, Tae-Kyu Lee, and Greg Baty. 2021. “Impact of in Situ Current Stressing on Sn-Based Solder Joint Shear Stability.” Journal of Materials Science: Materials in Electronics 32 (January): 2853–64. doi:10.1007/s10854-020-05038-3.