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Stress relaxation structure using Ni nano-particle/Al micro-particle composite paste for power device packaging

Authors :
Y. Tanaka
Y. Kitaguchi
K. Koshiba
T. Iizuka
K. Tatsumi
Source :
2023 International Conference on Electronics Packaging (ICEP).
Publication Year :
2023
Publisher :
IEEE, 2023.

Details

Database :
OpenAIRE
Journal :
2023 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........0671b569eb0334390a45f92b5d5a8ab1

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