Back to Search Start Over

Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis

Authors :
Y.-S. Liao
Hsien-Chie Cheng
Y.-H. Shen
W. H. Chen
Source :
2019 International Conference on Electronics Packaging (ICEP).
Publication Year :
2019
Publisher :
IEEE, 2019.

Abstract

In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.

Details

Database :
OpenAIRE
Journal :
2019 International Conference on Electronics Packaging (ICEP)
Accession number :
edsair.doi...........0645a85f148366e5b718d9ec65e60b96
Full Text :
https://doi.org/10.23919/icep.2019.8733567