Back to Search
Start Over
Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis
- Source :
- 2019 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2019
- Publisher :
- IEEE, 2019.
-
Abstract
- In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.
- Subjects :
- 010302 applied physics
Materials science
05 social sciences
01 natural sciences
Electronic circuit simulation
Power (physics)
Inductance
Power module
0103 physical sciences
MOSFET
Electronic engineering
Inverter
Equivalent circuit
0501 psychology and cognitive sciences
Power MOSFET
050104 developmental & child psychology
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2019 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........0645a85f148366e5b718d9ec65e60b96
- Full Text :
- https://doi.org/10.23919/icep.2019.8733567