Deposition-based patterning by area-selective deposition: Dielectric-on-dielectric and metal-on-metal using integrated Atomic Layer Deposition and thermally-driven Atomic Layer Etching (Conference Presentation)

Deposition-based patterning is becoming an important need in advanced manufacturing. Several new approaches are emerging where chemical etching is being coupled with atomic layer deposition to achieve area-selective deposition of dielectrics and metals. During ALD, selectivity is generally lost when undesired nuclei form on the targeted non-growth surface. These undesired nuclei can sometimes be removed by periodic etching, improving the overall selectivity. However, it is not known to what extent these coupled deposition/etching sequences can proceed while maintaining good selectivity. As desirable deposition and etching reactions proceed, other changes in the process can occur to enhance unwanted nucleation and/or impede desired etching, thereby limiting the net selectivity. Recent experiments in our lab have used in-situ probes to explore coupled thermal ALD and ALE super-cycles, performed sequentially under isothermal conditions in a single reaction chamber, to achieve area selective deposition of TiO2 on SiO2 with hydrogen-terminated silicon (100) as the desired non-growth surface. We find that as ALD/ALE super-cycles proceed, small changes occur in the ALD and ALE reactions, particularly during the transition from ALD to ALE, or from ALE to ALD. Likewise, a new thermally-driven ALE process for tungsten has been applied in ALD/ALE super-cycles to improve W ASD. In this case, the ALE process alters the ALD surface leading to significant changes in the ALD. Modeling studies allow us to quantitatively analyze the ASD results and compare our findings to other known approaches. These insights will be helpful to understand opportunities and challenges in advanced deposition-based patterning.