Passive mold alignment for the fabrication of polymer through-holes using punching and double-sided hot embossing

Subjects

Subjects :

Metals and Alloys
Electrical and Electronic Engineering
Condensed Matter Physics
Instrumentation
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :

09244247

Volume :

340

Database :

OpenAIRE

Journal :

Sensors and Actuators A: Physical

Accession number :

edsair.doi...........0494bf779ba6c2ac5de26a4db9564255

Full Text :

https://doi.org/10.1016/j.sna.2022.113560