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Improving Wirebonding Failure Classification Across Bond Recipe via Machine Learning
- Source :
- 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
- Accession number :
- edsair.doi...........02b79ba02891d3c05d10a218a28b3ad4
- Full Text :
- https://doi.org/10.1109/eptc56328.2022.10013249