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A new extraction method for estimating the bonding quality of metal bonding wafers
- Source :
- 9th Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits, EuroSOI 2013, EuroSOI 2013, Jan 2013, Paris, France. pp.P1.1
- Publication Year :
- 2013
- Publisher :
- HAL CCSD, 2013.
-
Abstract
- Section 1: Parameter extraction and measurements; International audience
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- 9th Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits, EuroSOI 2013, EuroSOI 2013, Jan 2013, Paris, France. pp.P1.1
- Accession number :
- edsair.dedup.wf.001..f31a36df9c54f4e21366897a1d1c499a