Focus on Links between High Frequency Substrate Noise and High Speed Signal Transmission in Interconnection Channels of 3D-IC

Authors :: Brocard, M.
Eid, E.
Lacrevaz, T.
Bermond, C.
Houzet, G.
Farcy, A.
Leduc, P.
Fléchet, B.
Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC)
Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS)
Institut de biologie et chimie des protéines [Lyon] (IBCP)
Université Claude Bernard Lyon 1 (UCBL)
Université de Lyon-Université de Lyon-Centre National de la Recherche Scientifique (CNRS)
Michelin, Isabelle
Source :: Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing, Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing, Apr 2012, grenoble, France
Publication Year :: 2012
Publisher :: HAL CCSD, 2012.
Abstract: International audience

Subjects :: [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
ComputingMilieux_MISCELLANEOUS

Language :: English
Database :: OpenAIRE
Journal :: Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing, Micro-Nano-Electronics Packaging & Assembly, Design and Manufacturing, Apr 2012, grenoble, France
Accession number :: edsair.dedup.wf.001..eb26e7e30f10e286b8fd98cc4d1c3dfe

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