Development of high temperature power module for avionics applications

PCIM 2004 - International conference power electronics, intelligent motion, power quality, Nuremberg, ALLEMAGNE, 25-/05/2004 - 27/05/2004; In avionic applications, a growing demand for devices being capable of operating at high temperatures is developing. In these applications, semiconductor devices are placed on the engine, in very harsh operating conditions with an ambient temperature which could reach about 200°c. The paper will present the realisation of test vehicles (power modules) dedicated to avionic applications in high temperature applications. The paper will also present electrical characterisation of semiconductor devices in high temperature operations in order to justify the choice of silicon carbibe schottky diodes and coolmos tansistors. The high temperature power module realised by apt europe will be presented in detail.