Hybrid bonding for 3D integration : challenges of the pitch shrinkage

MLA

Jourdon, Joris. Hybrid Bonding for 3D Integration : Challenges of the Pitch Shrinkage. Nov. 2019. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.dedup.wf.001..66204d3d949e93d04223a261404d5f2a&authtype=sso&custid=ns315887.

APA

Jourdon, J. (2019). Hybrid bonding for 3D integration : challenges of the pitch shrinkage.

Chicago

Jourdon, Joris. 2019. “Hybrid Bonding for 3D Integration : Challenges of the Pitch Shrinkage,” November. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.dedup.wf.001..66204d3d949e93d04223a261404d5f2a&authtype=sso&custid=ns315887.