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Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists
- Source :
- HAL, Smart Systems Integration, Smart Systems Integration, Mar 2014, Vienne, Austria. 8p
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Abstract
- International audience; We present the use of a novel dry film photoresist DF-1050 (EMS) for the integration of multilevel microfluidic systems. We showed that high resolution and high aspect ratio (7:1) can be achieved for free standing structures. We proved also that the dry film autofluorescence level is compatible with most of lab-on-a-chip applications and established the biocompatibility of this dry film. Ultimately, we demonstrated that this low-cost material combined with multilevel lamination technology would allow introducing massively 3D microfluidic in lab-on-a-chip devices.
Details
- Database :
- OpenAIRE
- Journal :
- HAL, Smart Systems Integration, Smart Systems Integration, Mar 2014, Vienne, Austria. 8p
- Accession number :
- edsair.dedup.wf.001..5270017a03f0815e3ea9c9d4b7b4ffe8