Silicon micromachining at cryogenic temperature

Authors :: Tillocher, Thomas
Lefaucheux, Philippe
Boufnichel, Mohamed
Dussart, Remi
Groupe de recherches sur l'énergétique des milieux ionisés (GREMI)
Université d'Orléans (UO)-Centre National de la Recherche Scientifique (CNRS)
STMicroelectronics [Tours] (ST-TOURS)
Source :: Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Publication Year :: 2017
Publisher :: HAL CCSD, 2017.
Abstract: International audience

Subjects :: [PHYS.PHYS.PHYS-PLASM-PH]Physics [physics]/Physics [physics]/Plasma Physics [physics.plasm-ph]
ComputingMilieux_MISCELLANEOUS

Language :: English
Database :: OpenAIRE
Journal :: Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), Design, Test, Integration and Packaging of MEMS/MOEMS 2017 (DTIP17), May 2017, Bordeaux, France
Accession number :: edsair.dedup.wf.001..3214d30a3d611ef8076328992ba4fd0d

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